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Rishika Datta добавлена новая статья Другое
2026-03-30 09:56:03 - Перевод -

Advanced Semiconductor Packaging Drives Die Thinning Services Market Growth at 7.8% CAGR
According to a new report from Intel Market Research, the global Die Thinning Services market was valued at USD 1.45 billion in 2025 and is projected to reach USD 2.75 billion by 2034, growing at a steady CAGR of 7.8% during the forecast period (2026-2034). This growth is driven by increasing demand for advanced semiconductor packaging and the rapid expansion of IoT and 5G technologies...

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Rishika Datta добавлена новая статья Другое
2026-04-01 10:16:35 - Перевод -

Global COG Packaging Market Set to Reach USD 6.9 Billion by 2034 Amid Display Technology Boom
According to a new report from Intel Market Research, the global COG Packaging Market was valued at USD 3.8 billion in 2025 and is projected to reach USD 6.9 billion by 2034, growing at a steady CAGR of 5.7% during the forecast period (2025-2034). This growth trajectory reflects the increasing demand for high-resolution displays across consumer electronics and automotive applications, as well...

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Shraddha Thakur добавлена новая статья Networking
2025-12-11 09:50:55 - Перевод -

Global Wi-Fi Chipsets Market to Reach USD 23.18 Billion by 2032
Wi-Fi Chipsets Market, valued at USD 17,850 million in 2024, is projected to grow from USD 18,550 million in 2025 to USD 23,180 million by 2032, exhibiting a compound annual growth rate (CAGR) of 3.9%. This trajectory is detailed in a comprehensive new report by Semiconductor Insight. The study underscores the indispensable role these components play in powering the modern connected world, from...

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